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Practical, engineer-written guidance on connector technologies, signal integrity, and interconnect design — for high-speed, board-to-board, EV, and data-center applications.
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What Is an OCP Server? OCP vs Traditional Racks Explained
An OCP server is built to an Open Compute Project specification. Learn how Open Rack differs from a 19-inch rack and which connectors change.
What Does "OCP/ORV3 Compliant" Mean? Connector Requirements Checklist
OCP connectors get called "compliant" loosely — but there's informal spec conformance, and then there's OCP Accepted™ and OCP Inspired™, two very different formal designations. Here's the actual checklist.
PCIe Power Delivery: Slot Power Limits and Add-In Card Power Connectors
A complete technical breakdown of PCIe power delivery. Explore the 75W slot rail limit, auxiliary cable configurations, and design rules for high-power cards.
Connector requirements for electric vehicles (EVs)
Examine the specialized engineering requirements for EV interconnects. Learn high-voltage safety (HVIL), IP6K9K sealing, thermal management, and creepage/clearance rules.
Explore by Topic
AI / GPU Data Center Interconnect Architecture
AI and GPU-driven infrastructure is pushing interconnect design further than traditional servers ever required — more bandwidth, higher power density, and tighter thermal margins, all at once. Here's how connector and interconnect choices shape modern AI data center architecture.
PCIe & CEM Slot Connectors
PCIe CEM slots are the physical backbone of add-in card design — from GPUs and NICs to storage controllers. This hub breaks down slot keying, form factors, power delivery, and the signal integrity demands of PCIe Gen4 through Gen7, for engineers designing or specifying expansion-card hardware.
OCP Server Interconnects
Open Compute Project (OCP) hardware trades proprietary server design for open, standardized interconnects — from management modules and rack-level power busbars to AI accelerator baseboards and storage. Here's how these specifications shape real hardware decisions for engineers building on OCP platforms.
TE Connectivity launches TE MINI FAKRA coaxial connector system for vehicle data links
TE Connectivity has launched the TE MINI FAKRA connector system, a miniaturized coaxial connector designed to support data transmission in connected, automated and software-defined vehicles. The connector system provides RF... Read more »
CScale exits stealth mode with $145m funding for gigawatt-scale AI
CScale, a Palo Alto startup for optical interconnects, has exited stealth mode with the announcement of $145 million in Series C funding. Nvidia and Intel Capital were among the investors. […] The post CScale exits stealth mode with $145m funding for gigawatt-scale AI appeared first on Electronics Weekly.
Bringing Down Test Costs For Co-Packaged Optics
Pinpointing failures, ensuring known-good optical engines, and controlling test costs become increasingly critical as photonics moves into advanced packages. The post Bringing Down Test Costs For Co-Packaged Optics appeared first on Semiconductor Engineering.
Silicon Photonic Modulator Reaches 200 Gb/s PAM4 With Reduced DSP (Science Tokyo, Yokohama, AIST, PETRA)
Researchers from Institute of Science Tokyo, Yokohama National University, AIST, and Photonics Electronics Technology Research Association (PETRA) published a technical paper titled “Reduced-DSP 200G/λ Low-Voltage Slow-Light Silicon Modulator Enabled by Built-In EO Equalizer.” Abstract Excerpt: “Multi-Tb/s optical interconnects for artificial intelligence data centers necessitate high-speed, energy-efficient, and compact transceivers. However, conventional silicon Mach-Zehnder modulators are...
AJ Cooper is the Co-Founder and CEO of Itera
AJ Cooper is the Co-Founder and CEO of Itera, which developed the first-of-its-kind ‘fluid’ circuit board to make electronics physically programmable. Chips and software have been programmable for decades, but the interconnect between them has stayed fixed. By rewiring itself in real time, Itera’s board challenges … Read More The post AJ Cooper is the Co-Founder and CEO of Itera appeared first on SemiWiki.
The Wafer Is the New Battleground: Soitec CPO René Jonker on Building AI from the Substrate Up
Most of the AI conversation stops at the chip. At SEMICON West 2026 I sat down with René Jonker, Chief Product Officer of Soitec, to talk about what sits underneath it. Ask an engineer where AI performance comes from and you will hear about process nodes, dataflow, HBM stacks and interconnect fabrics. Rarely about the wafer. Yet a … Read More The post The Wafer Is the New Battleground: Soitec CPO René Jonker on Building AI from the Substrate Up appeared first on SemiWiki.
Categories
All categories →AI Server & Data Center Connectors
02Application Spotlights
03Automotive Connectors
04Board-To-Board
05Cable Harness & Assemblies
06Connector Fundamentals
07FPC & FFC Connectors: Guides, Comparisons & Selection Tools
08Floating Connector
09High-Speed Connectors & Signal Integrity
10Interconnect Components
11Raw Cable
12Supply Chain & Sourcing
Latest Articles
All articles →
What Is an OCP Server? OCP vs Traditional Racks Explained
An OCP server is built to an Open Compute Project specification. Learn how Open Rack differs from a 19-inch rack and which connectors change.
Battery Cell Interconnect Systems: CCS, Busbars and FPC Explained
A cell interconnect system joins battery cells and carries sensing signals to the BMS. Compare CCS, busbars and FPC, and see how cell format changes the design.
Camera SerDes Overview: Automotive GMSL and FPD-Link
Automotive ADAS cameras rely on SerDes to stream high-resolution video over long single-pair cables. Learn how GMSL and FPD-Link work and which connectors carry them.
ZIF vs. LIF vs. Non-ZIF FPC Connectors Explained
Choosing between ZIF, LIF, and non-ZIF FPC connectors affects cost and durability. Learn how they differ, how actuators work, and where each design fails.
Cable Derating Factor: How to Calculate Current Capacity
Current carrying capacity drops when cables are bundled or exposed to high heat. Learn how to calculate the true cable derating factor with worked examples.
OCP and ORv3-Compliant Connectors: Standards Guide
OCP specifications define high-density power and signal interconnects. This guide maps each OCP domain to the connector family it uses and to our detailed articles.