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What Does "OCP/ORV3 Compliant" Mean? Connector Requirements Checklist
OCP connectors get called "compliant" loosely — but there's informal spec conformance, and then there's OCP Accepted™ and OCP Inspired™, two very different formal designations. Here's the actual checklist.
Connector requirements for electric vehicles (EVs)
Examine the specialized engineering requirements for EV interconnects. Learn high-voltage safety (HVIL), IP6K9K sealing, thermal management, and creepage/clearance rules.
Automotive camera connectors: SerDes and high-speed interfaces
Explore automotive camera SerDes architectures. Learn GMSL, FPD-Link, and MIPI A-PHY protocol integration, Power over Coax (PoC) design, and coax vs STP selection.
Connector types explained: A complete guide for beginners
Get a comprehensive overview of fundamental connector types in hardware engineering. Learn how to distinguish board-to-board, wire-to-board, wire-to-wire, and FFC/FPC interconnects for PCB design.
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AI / GPU Data Center Interconnect Architecture
AI and GPU-driven infrastructure is pushing interconnect design further than traditional servers ever required — more bandwidth, higher power density, and tighter thermal margins, all at once. Here's how connector and interconnect choices shape modern AI data center architecture.
OCP Server Interconnects
Open Compute Project (OCP) hardware trades proprietary server design for open, standardized interconnects — from management modules and rack-level power busbars to AI accelerator baseboards and storage. Here's how these specifications shape real hardware decisions for engineers building on OCP platforms.
PCIe & CEM Slot Connectors
PCIe CEM slots are the physical backbone of add-in card design — from GPUs and NICs to storage controllers. This hub breaks down slot keying, form factors, power delivery, and the signal integrity demands of PCIe Gen4 through Gen7, for engineers designing or specifying expansion-card hardware.
Heterogeneous Memory Chiplets Accelerate Multi-Request LLM Inference (NUS)
Researchers at the National University of Singapore published a technical paper titled “CHIPSMORE: Compute-in-Interconnect and -Memory Chiplets for Multi-Mode Multi-Request LLM Inference Acceleration.” Abstract Excerpt: “This paper presents CHIPSMORE, a multi-mode and multi-request LLM inference accelerator that integrates compute-in-interconnect and CIM to support both base-mode and low-rank adaptation (LoRA) inference under diverse workloads. CHIPSMORE employs... » read more The post Heterogen
Modeling Predicts Cure And Thermal Endurance Of Advanced Packaging Underfill (NIST, UCSD et al.)
Researchers at the NIST, UCSD et al. published a technical paper titled “Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging.” Abstract Excerpt: “Epoxy underfill materials are critical to advanced semiconductor packaging by enhancing mechanical integrity, redistributing thermomechanical stresses, and improving solder-joint reliability in flip-chip and other fine-pitch interconnect... » read more The post Modeling Predicts Cure And Thermal End
Small But Mighty: The Role of Connectors in Modern Electronics
From simplifying assembly to enabling repairs and upgrades, learn how the right connectors can impact electronic system performance and longevity.
Zuken Launches E3.series 2027 With Expanded Engineering and Manufacturing Capabilities
Zuken today announced E3.series 2027, the latest release of its electrical design software for wiring, wire harness, fluid, and control systems design. The release focuses on making engineering information more accessible and easier to carry into manufacturing and downstream processes. Key additions include E3.CloudView for browser-based access to project documentation, workflow enhancements for common engineering … Read More → "Zuken Launches E3.series 2027 With Expanded Engineering and Manufac
ETEK’s lineup of OCPP 1.6J-compliant DC fast chargers ranges from 20 kW compact units to 600 kW split systems
ETEK Electric manufactures a variety of DC fast chargers, ranging from a 20-60 kW compact unit (the EKDC1 series) to a 240-600 kW split system (the EKDC6). All products support OCPP 1.6J, and all offer CCS1, CCS2, GB/T and CHAdeMO connector options. The EKDC2 is a floor-standing dual-connector charging station designed for commercial, fleet and... Read more »
CXL and Memory Expansion
How is CXL memory pooling making a difference in AI data centers?
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What Does "OCP/ORV3 Compliant" Mean? Connector Requirements Checklist
OCP connectors get called "compliant" loosely — but there's informal spec conformance, and then there's OCP Accepted™ and OCP Inspired™, two very different formal designations. Here's the actual checklist.
How to Read Connector Thermal Derating Curves: A Practical Guide
Operating connectors near ambient temperature limits requires current derating. Learn to interpret manufacturer curves, apply safety margins, and avoid critical thermal errors.
HVIL Connector Design: High-Voltage Interlock Loop for EV Battery Disconnects
HVIL is a fundamental safety mechanism in electric vehicles. Explore the mechanical contact sequencing, circuit mechanics, and failure modes of HVIL disconnects.
Single Pair Ethernet Connectors: M8 vs. M12 vs. Automotive-Specific Variants
Single Pair Ethernet reduces weight and complexity by delivering data and power over one pair. Explore physical differences between industrial M8/M12 and automotive SPE variants.
Connector Galvanic Corrosion: Avoiding Contact Plating Incompatibility
Mating incompatible contact platings like gold and tin triggers accelerated galvanic corrosion. Discover how to select compatible metal pairs and prevent field failures.
Test Point and Probe-Compatible Connector Design for In-Circuit Test
In-Circuit Testing relies on physical spring-probe contact. Uncover key Design-for-Test (DFT) rules to prevent probe interference and ensure high test coverage.