Blog
Commentary, industry trends, and updates from the interconnect world.
Beyond Manual Routing: AI Optimization in High-Speed Connector Design
Designing modern high-speed connectors requires balancing complex signal integrity, thermal dissipation, and mechanical limits. Discover how AI algorithms are replacing manual pin optimization.
Bypassing the Board: Solving the 224Gbps PAM-4 Signal Integrity Bottleneck
As data rates climb to 224Gbps per lane using PAM-4 signaling, traditional PCB copper traces hit a physical wall. Discover how near-chip twinax bypass cable assemblies are replacing standard routing to rescue signal integrity.
The Interconnect Crossroads: Co-Packaged Optics vs. Near-Chip Copper
As data centers demand unprecedented bandwidth, the battle lines are drawn between Co-Packaged Optics (CPO) and advanced near-chip copper solutions. Explore the trade-offs in power, cost, and reliability.
Navigating the Split: Supply Chain Bifurcation and Extended Component Lead Times
The hardware supply chain has fractured. Discover why standard connectors are readily available while advanced high-density backplanes and 800G/1.6T transceivers face lead times exceeding 40 weeks.
Designing for PCIe Gen 7: Maximizing Performance in Ultra-Low Profile Spaces
PCIe Gen 7 brings an incredible 128 GT/s throughput, but its tight margins require strict management of signal loss. Examine the mechanical and electrical innovations defining ultra-low profile mezzanine and card-edge connectors.
Bridging Power and Pixels: The Engineering of Zonal Automotive Connectors
The transition to software-defined vehicles and zonal architectures demands hybrid connector systems capable of shielding high-speed sensor streams right next to 800V powertrain cables.
Compressing the Interface: Scaling Compute Sockets with Sub-0.5mm Pogo Pins
As silicon pin density surges and space disappears, spring-loaded pogo pin arrays with sub-0.5mm pitches are stepping up to deliver high-performance vertical interconnects.
Stripping the Complexity: Overcoming DIY Pitfalls in Micro-Interconnect Assembly
Hand-crimping sub-2mm pitch connectors or deploying cheap flexible flat cables in custom hardware prototypes often leads to signal degradation. Learn how to avoid these common assembly mistakes.
Breaking the Thermal Barrier: Integrating Liquid Cooling into Pluggable I/O Cages
As data center infrastructure transitions to liquid cooling, front-panel optical transceivers face severe thermal limits. Discover how passive thermal bridge innovations are reshaping connector hardware.
Eliminating Human Error: The Shift to Blind-Mate Optical Backplanes
Manually connecting fragile fiber optics in dense server racks carries immense risk. Explore the mechanical alignment systems and micro-optics enabling robust blind-mate backplanes.
Overcoming the AI Compute Footprint Bottleneck: Hybrid Connectors in 2026 Data Centers
The rapid scaling of generative AI accelerators in 2026 has pushed server rack power profiles to an astonishing 100kW. Discover how hybrid board-to-board connectors prevent hardware footprints from expanding under massive data and power loads.