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Curated headlines from trusted electronics and connector industry publications — FFC, FPC, board-to-board, EV, semiconductor, and data center interconnect news.

General

Heterogeneous Memory Chiplets Accelerate Multi-Request LLM Inference (NUS)

Researchers at the National University of Singapore published a technical paper titled “CHIPSMORE: Compute-in-Interconnect and -Memory Chiplets for Multi-Mode Multi-Request LLM Inference Acceleration.” Abstract Excerpt: “This paper presents CHIPSMORE, a multi-mode and multi-request LLM inference accelerator that integrates compute-in-interconnect and CIM to support both base-mode and low-rank adaptation (LoRA) inference under diverse workloads. CHIPSMORE employs... » read more The post Heterogen

Semiconductor Engineering · 11 SEPT 2026Read more →

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Semiconductor

Modeling Predicts Cure And Thermal Endurance Of Advanced Packaging Underfill (NIST, UCSD et al.)

Researchers at the NIST, UCSD et al. published a technical paper titled “Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging.” Abstract Excerpt: “Epoxy underfill materials are critical to advanced semiconductor packaging by enhancing mechanical integrity, redistributing thermomechanical stresses, and improving solder-joint reliability in flip-chip and other fine-pitch interconnect... » read more The post Modeling Predicts Cure And Thermal End

Semiconductor Engineering · 11 SEPT 2026Read more →

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General

Small But Mighty: The Role of Connectors in Modern Electronics

From simplifying assembly to enabling repairs and upgrades, learn how the right connectors can impact electronic system performance and longevity.

Electronic Design – Components · 11 SEPT 2026Read more →

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General

Zuken Launches E3.series 2027 With Expanded Engineering and Manufacturing Capabilities

Zuken today announced E3.series 2027, the latest release of its electrical design software for wiring, wire harness, fluid, and control systems design. The release focuses on making engineering information more accessible and easier to carry into manufacturing and downstream processes. Key additions include E3.CloudView for browser-based access to project documentation, workflow enhancements for common engineering … Read More → "Zuken Launches E3.series 2027 With Expanded Engineering and Manufac

EE Journal · 11 SEPT 2026Read more →

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General

ETEK’s lineup of OCPP 1.6J-compliant DC fast chargers ranges from 20 kW compact units to 600 kW split systems

ETEK Electric manufactures a variety of DC fast chargers, ranging from a 20-60 kW compact unit (the EKDC1 series) to a 240-600 kW split system (the EKDC6). All products support OCPP 1.6J, and all offer CCS1, CCS2, GB/T and CHAdeMO connector options. The EKDC2 is a floor-standing dual-connector charging station designed for commercial, fleet and... Read more »

Charged EVs · 09 SEPT 2026Read more →

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Data Center

CXL and Memory Expansion

How is CXL memory pooling making a difference in AI data centers?

Electronic Design – Data Center · 09 SEPT 2026Read more →

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General

How Does Miniaturization Influence Microwave Filter Performance?

Scaling down RF circuit footprints requires balancing board space against critical trade-offs. Discover how loading methods and high-dielectric substrates impact Q factor and insertion loss.

All About Circuits · 08 SEPT 2026Read more →

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General

Up to 100 Meters Between Vehicle and Charging Station: Vector Launches vSECC.InPlug for Bus and Truck Depots

Vector is introducing vSECC.InPlug, a new communication controller board for DC charging infrastructures. By relocating charging communication directly into the DC charging connector, the solution enables cable runs of up to 100 meters between vehicle and charging station. This gives bus and truck depot operators greater flexibility when planning and building their charging infrastructure. Moreover, … Read More → "Up to 100 Meters Between Vehicle and Charging Station: Vector Launches vSECC.InPlu

EE Journal · 08 SEPT 2026Read more →

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General

Imec advances scalable superconducting technology with world-first NbTiN circuits and 30nm interconnects

• At the 2026 Applied Superconductivity Conference, imec demonstrates two world-firsts: (1) a three-metal-level (3ML) niobium-titanium-nitride (NbTiN)-based Josephson junction circuit, achieving circuit design densities of 3.8 million junctions per cm2; and (2) 3ML NbTiN routing with superconducting wires scaled down to an unprecedented 30nm linewidth for superconducting digital (SCD) applications. • The achievements extend imec’s … Read More → "Imec advances scalable superconducting technology

EE Journal · 08 SEPT 2026Read more →

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General

Rivian’s Gambit for Full Autonomy

I’m sitting in a Rivian R1S SUV as it drives itself down the leafy streets of Palo Alto, Calif., through areas crowded with touchstones of tech history. At one point I pass the landmark HP Garage, the one-car workshop where Hewlett-Packard, and, arguably, Silicon Valley, was founded in 1939. I skirt Stanford University, where a team led by computer science professor Sebastian Thrun won a US $2 million DARPA Grand Challenge in 2005. The team’s Volkswagen SUV, named Stanley, became the world’s fir

IEEE Spectrum · 08 SEPT 2026Read more →

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General

Research Bits: Sept. 8

Carbon insulator for interconnects; high-temperature SiC JFETs; VCT dielectric. The post Research Bits: Sept. 8 appeared first on Semiconductor Engineering.

Semiconductor Engineering · 08 SEPT 2026Read more →

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General

Powell Electronics shows latest highly reliable connector solutions for rail applications at Innotrans 2026

At Innotrans 2026 in Berlin, Germany from 22nd to 25th Sept 2026, Powell Electronics will be showing the latest hi-reliability connector solutions for harsh environment rail applications from its key franchises, e.g. Amphenol, Glenair, Honeywell, Samtec and ITT Cannon. Visitors to Powell’s stand in Hall 14.1 Stand 210 will be able to talk to the technical experts … Read More → "Powell Electronics shows latest highly reliable connector solutions for rail applications at Innotrans 2026"

EE Journal · 07 SEPT 2026Read more →

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Data Center

Kioxia’s Flash-for-DRAM Initiative Eyes AI Workloads

The CXL-attached memory expansion uses NAND flash optimized for high-speed processing alongside AI compute devices. The post Kioxia’s Flash-for-DRAM Initiative Eyes AI Workloads appeared first on EE Times.

EE Times · 07 SEPT 2026Read more →

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Semiconductor

Comparing Advanced Packaging from TSMC, Intel Foundry, and Samsung Foundry

Advanced semiconductor packaging has become essential to improving computing performance as conventional transistor scaling grows more difficult and expensive. Instead of manufacturing an entire processor as one large monolithic die, chipmakers can divide it into smaller chiplets and combine logic, memory, input/output… Read More The post Comparing Advanced Packaging from TSMC, Intel Foundry, and Samsung Foundry appeared first on SemiWiki.

SemiWiki · 06 SEPT 2026Read more →

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General

IQE extends supply agreement with Quintessent

IQE, the Cardiff compound semiconductor materials specialist, has signed  a purchase agreement with Quintessent, the optical interconnect supplier, for Quantum Dot Laser (QDL) epitaxial wafers. Following an initial strategic announcement […] The post IQE extends supply agreement with Quintessent appeared first on Electronics Weekly.

Electronics Weekly · 04 SEPT 2026Read more →

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Data Center

Push long-haul network reach to 2,400km with new ProLabs coherent transceivers

Both QSFP-DD 800G ZR LH and QSFP-DD 400G ZR ULH are purpose built for carriers, service-providers, and large-scale backbone networks across the United Kingdom requiring ultra-long-haul coherent transmission. The transceivers enable operators to extend the reach of 400G and 800G networks across national and cross-continental infrastructure without compromising performance. “We are delighted to have expanded our … Read More → "Push long-haul network reach to 2,400km with new ProLabs coherent tran

EE Journal · 03 SEPT 2026Read more →

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Board-to-Board

Hirose Develops High-Speed Automotive Ethernet Connector for Compact Applications

Hirose has unveiled the GT37 Series wire-to-board connector designed for high-speed automotive Ethernet applications. As vehicle architectures incorporate more electronic control units, cameras, sensors, displays, communication modules, and advanced driver-assistance systems (ADAS), protecting sensitive signals from electromagnetic interference (EMI) has become a critical design consideration. The GT37 Series addresses this challenge with a fully shielded … Read More → "Hirose Develops High-Spee

EE Journal · 03 SEPT 2026Read more →

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General

Protecting Dynamic Industrial Robot Cable Carriers

This article is brought to you by Tsubaki KabelSchlepp. In modern automated manufacturing, six-axis articulated robots perform high-speed, multidirectional maneuvers under demanding operational cycles. However, as robot arms swivel, rotate, and extend, the electrical cables, fiber optics, and pneumatic hoses supplying them endure severe mechanical stress. Torsional twist, rapid acceleration, and repeated contact with machine structures often lead to premature conductor fatigue, insulation breakd

IEEE Spectrum · 03 SEPT 2026Read more →

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General

Why press-fit technology continues to expand

As press-fit is deployed across more applications, PCB interconnects must handle increasing levels of integration, power density and connector density, writes Michael Meckl. Figure 1: Cross-sectional comparison of soldered and […] The post Why press-fit technology continues to expand appeared first on Electronics Weekly.

Electronics Weekly · 03 SEPT 2026Read more →

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General

The Evolution Of Intelligent Systems: From Optimization To Automation to AI

Engineering methodologies are evolving toward more integrated and intelligent approaches across three interconnected domains: optimization, automation, and AI. The post The Evolution Of Intelligent Systems: From Optimization To Automation to AI appeared first on Semiconductor Engineering.

Semiconductor Engineering · 02 SEPT 2026Read more →

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General

TE Connectivity to acquire HENN’s air and fluid connection systems unit

TE Connectivity has entered a definitive agreement to acquire the plastic air and fluid connection systems business unit of HENN Connector Group, an automotive connection-systems supplier, adding thermal-management hardware to a portfolio of electrical power and data connectors. The acquired unit will be integrated into TE’s global offering under the name HENN Fluid Line, and... Read more »

Charged EVs · 01 SEPT 2026Read more →

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General

The Link Budget Is Decided at the Connector

Scale-up optics will be decided by the link budget. The largest recoverable losses sit at the connector and inside the silicon photonics platform. The post The Link Budget Is Decided at the Connector appeared first on EE Times.

EE Times · 01 SEPT 2026Read more →

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General

Chip Industry Technical Paper Roundup: Sep. 1

Wafer-scale optical interconnects for LLM training; Rowhammer-based inference attacks; 3D-IC test cases; liquid cooling for 2.5D/3D packages; wafer-scale 2D semi growth; DL-based parameter extraction for 2D transistors; and chip-placement optimization. The post Chip Industry Technical Paper Roundup: Sep. 1 appeared first on Semiconductor Engineering.

Semiconductor Engineering · 01 SEPT 2026Read more →

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General

Ferroelectric Tuning Reduces Optical-Interconnect Stalls In LLM Training (Georgia Tech)

Researchers from Georgia Institute of Technology published a technical paper titled “Thermal Tuning Overhead in Wafer-Scale Optical Interconnects for LLM MoE Training: A Cross-Layer Analysis and Ferroelectric-Based Mitigation.” Abstract Excerpt: The paper analyzes “wafer-scale optical interconnects” for mixture-of-experts LLM training and finds “repeated tuning stalls during communication phases.” It also reports “speedups of 2.7x” for... » read more The post Ferroelectric Tuning Reduces Optical

Semiconductor Engineering · 28 AUG 2026Read more →

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General

Compact Connector Series from Lane Electronics Meet Rapidly Expanding Drone Market Requirements

Lane Electronics,  a market-leading franchised distributor for many of the industry’s major electrical, electronic and optical connector manufacturers is highlighting a range of proven interconnect solutions which may be ideally suited to the rapidly evolving Unmanned Aerial Vehicle (UAV) market. As defence and commercial drone programmes increasingly demand lower-cost, lightweight platforms delivered within ever-shorter development cycles, … Read More → "Compact Connector Series from Lane Elect

EE Journal · 27 AUG 2026Read more →

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General

Keysight Accelerates AttoTude IC Design Cycles by More Than 50%

Keysight Technologies, Inc. (NYSE: KEYS) today announced that AttoTude Inc., a pioneer of next-generation ASICs over Dielectric interconnect technology for AI and hyperscale data center applications, has expanded its use of Keysight EDA software to manage its full IC design workflow. As a result, AttoTude has reduced its design cycles by more than 50% while … Read More → "Keysight Accelerates AttoTude IC Design Cycles by More Than 50%"

EE Journal · 27 AUG 2026Read more →

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General

Streamlining 3D-IC Design: Substrate, Finalization, And Tapeout

Effective substrate implementation is crucial for signal integrity, power delivery, and overall system reliability. The post Streamlining 3D-IC Design: Substrate, Finalization, And Tapeout appeared first on Semiconductor Engineering.

Semiconductor Engineering · 27 AUG 2026Read more →

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General

F C Lane’s compact connectors target evolving drone market

Weald Electronics compact connectors addressing the evolving UAV (unmanned aerial vehicle) market are available from Lane Electronics, the specialist connector distributor. Lane Electronics highlights the LM200 2mm pitch connector systems, […] The post F C Lane’s compact connectors target evolving drone market appeared first on Electronics Weekly.

Electronics Weekly · 26 AUG 2026Read more →

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Board-to-Board

Hirose Announces Commercial Availability of its Compact, 1000V Wire-to-Board Connector for Automotive Powertrains

Hirose has announced the commercial availability of its high-voltage ZE150HV Series wire-to-board connector. Ideal for electric vehicle (EV) and hybrid electric vehicle (HEV) powertrains, the connector features a 4.5 mm pitch and supports 1000V AC/DC, 10A per pin, and operating temperatures up to 125°C. Engineered to meet IEC 60664 standards (Pollution Degree 2, altitude 6,000m), … Read More → "Hirose Announces Commercial Availability of its Compact, 1000V Wire-to-Board Connector for Automotive

EE Journal · 25 AUG 2026Read more →

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General

Optocouplers tame EMI in wide-bandgap designs

High-voltage designers adopting GaN and SiC face severe electromagnetic interference (EMI) and logic corruption. Advanced optocouplers can provide the robust isolation needed to protect signal integrity, writes Diego de Azcuénaga. […] The post Optocouplers tame EMI in wide-bandgap designs appeared first on Electronics Weekly.

Electronics Weekly · 25 AUG 2026Read more →

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Semiconductor

Powering the Future: Indium Corporation to Present Next Gen Semiconductor Packaging Solutions at PCIM Asia

Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how key material innovations can collaboratively address cutting-edge advanced packaging process challenges at PCIM Asia 2026, August 26-28, in Shenzhen, China. The presentation, titled Next-Gen Advanced Packaging Materials and System Integration for Power Electronics, examines how advanced interconnection materials and process innovations work together to improve yield, reliability, and manufacturability in next-generation se

EE Journal · 24 AUG 2026Read more →

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General

Lotus Microsystems Moves Power Conversion Under AI Processors

LSC0580 combines silicon interconnects, integrated passives, and thermal management to reduce the power delivery path to AI processors. The post Lotus Microsystems Moves Power Conversion Under AI Processors appeared first on Power Electronics News.

Power Electronics News · 24 AUG 2026Read more →

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General

Quintessent begins sampling single-chip DWDM comb laser

Following a Series A investment round which raised $40m, optical interconnect startup, Quintessent, is sampling its single-chip quantum dot-based DWDM (dense wavelength division multiplexing) comb laser. Described as a new […] The post Quintessent begins sampling single-chip DWDM comb laser appeared first on Electronics Weekly.

Electronics Weekly · 24 AUG 2026Read more →

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General

Lane Electronics to show Defence and Security Connectivity at MSPO 2026

Lane Electronics,  a market-leading franchised distributor for many of the industry’s major electrical, electronic and optical connector manufacturers, will be Exhibiting at MSPO 2026, on stand 4-E06, where they will be displaying the latest connector innovations and demonstrating their UK based assembling and value add services. MSPO is a forum for innovation and policy, with exhibitions … Read More → "Lane Electronics to show Defence and Security Connectivity at MSPO 2026"

EE Journal · 21 AUG 2026Read more →

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General

Chip Industry Week In Review

New Micron lab; chip/AI price jump; multi-die monitoring; cryo links for quantum chips; interconnect RC bottleneck; 18A win; CPO roadmap; 2 new CEOs; humanoid readiness gap; Hot Interconnects. The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

Semiconductor Engineering · 21 AUG 2026Read more →

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Data Center

Synopsys Rolls Out First Complete CXL 4.0 IP for AI Memory Connectivity

The controller, PHY, security, and verification IP support 128 GT/s links and target rack-scale memory pools exceeding 100 TB.

All About Circuits · 21 AUG 2026Read more →

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Data Center

Synopsys Updates CXL IP Portfolio for AI-Era Infrastructure

Synopsys’s CXL 4.0 IP aims to help designers build faster, more flexible and secure disaggregated computing architectures as AI systems demand more memory capacity and bandwidth. The post Synopsys Updates CXL IP Portfolio for AI-Era Infrastructure appeared first on EE Times.

EE Times · 20 AUG 2026Read more →

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General

How to choose connectors for eVTOL aircraft

Electrical architectures with a selection of connectors are key to facilitating the reliable transmission of power and data under extreme operational conditions for aircraft, writes Sean Fitall. Electric Vertical Takeoff […] The post How to choose connectors for eVTOL aircraft appeared first on Electronics Weekly.

Electronics Weekly · 20 AUG 2026Read more →

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General

Power Corner: Modeling the AI Data Center Power Train with MathWorks

MathWorks' Tony Lennon explains how multi-domain simulation models AI data center power, cooling, and grid interconnection. The post Power Corner: Modeling the AI Data Center Power Train with MathWorks appeared first on Power Electronics News.

Power Electronics News · 20 AUG 2026Read more →

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General

CFETs Forge Better Connections

Performance advantage may come down to material choices and precise interconnect decisions. The post CFETs Forge Better Connections appeared first on Semiconductor Engineering.

Semiconductor Engineering · 20 AUG 2026Read more →

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General

IBM Makes Quantum Cryogenics Modular, but Scaling Problems Remain

IBM’s new cryogenic architecture tackles one obstacle to fault-tolerant quantum computing, while exposing wiring, control, interconnect, and reliability challenges. The post IBM Makes Quantum Cryogenics Modular, but Scaling Problems Remain appeared first on EE Times.

EE Times · 19 AUG 2026Read more →

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General

The Future Of AI Compute Won’t Run On Just One Kind Of Chip

Power, token cost, interconnects, and software orchestration are pushing data centers toward heterogeneous clusters built from CPUs, GPUs, NPUs, optics, and custom accelerators. The post The Future Of AI Compute Won’t Run On Just One Kind Of Chip appeared first on Semiconductor Engineering.

Semiconductor Engineering · 19 AUG 2026Read more →

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Semiconductor

ECTC call for papers

The 2027 IEEE Electronic Components and Technology Conference (ECTC), the technical conference and product exhibition for the semiconductor packaging industry, has announced a Call for Papers. ECTC 2027 will take […] The post ECTC call for papers appeared first on Electronics Weekly.

Electronics Weekly · 19 AUG 2026Read more →

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Data Center

Marvell Targets AI Bottlenecks with Memory-Disaggregation Portfolio

Marvell attacks AI’s memory choke point with SSD, CXL, and photonic fabrics to push data nearer compute. The post Marvell Targets AI Bottlenecks with Memory-Disaggregation Portfolio appeared first on EE Times.

EE Times · 18 AUG 2026Read more →

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General

56G MezzaWave Connectors and Cable Assemblies — TE Connectivity and Mouser Electronics

In this episode of Chalk Talk, Christian Jacinto from TE Connectivity and I explore the benefits of 56G MezzaWave Connectors and Cable Assemblies family which include support for high-performance data rates up to 56Gbps PAM4, design flexibility, and reliable operation across a wide temperature range. We also discuss the common engineering questions surrounding these … Read More → "56G MezzaWave Connectors and Cable Assemblies — TE Connectivity and Mouser Electronics"

EE Journal · 17 AUG 2026Read more →

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General

Automotive Functional Safety: Why ASIL Compliance Starts with Electromagnetic Design

Automotive electronic systems face relentless pressure to meet electromagnetic compatibility (EMC), signal integrity (SI), and power integrity (PI) targets while satisfying strict ASIL safety requirements. Too often, engineers discover problems late: EMC failures surface during vehicle integration, signal ringing degrades high-speed links, via stub resonance reflects energy above 3 Gbps, power delivery networks collapse under […] The post Automotive Functional Safety: Why ASIL Compliance Starts

EE Times · 17 AUG 2026Read more →

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General

Highly rugged GAPS & HAPS aerospace proximity sensors from Honeywell now available through Powell Electronics

Now available through Powell Electronics, the supplier of connectors and more for high-rel applications including defence, aerospace and industrial, are the GAPS (General Aerospace Proximity Sensors) and HAPS (Harsh Application Proximity Sensors) proximity sensors from Honeywell. Both sensor series incorporate Honeywell’s patented integrated health monitoring functionality, however the products have some technical differences that allow them … Read More → "Highly rugged GAPS & HAPS aerospace pro

EE Journal · 17 AUG 2026Read more →

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General

Cinch Adds Five MD801 Connector Configurations for Space- and Weight-Constrained Defense Applications

Cinch Connectivity Solutions, a Bel group company and global leader in reliable connectivity solutions, today announced the expansion of its Mil/Aero Circular MD801 Series, adding five new configurations designed to meet the weight, space, and reliability demands of modern defense platforms. This expansion builds on Cinch’s proven MD801 portfolio, which includes a Picatinny CLIK-compliant and … Read More → "Cinch Adds Five MD801 Connector Configurations for Space- and Weight-Constrained Defense

EE Journal · 17 AUG 2026Read more →

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EV

The Charging Inlet Has Become a System: Rethinking EV Charge-Control Electronics 

Explore how integrated charge-control architecture reduces complexity while supporting J3400, MCS, and global EV platforms. The post The Charging Inlet Has Become a System: Rethinking EV Charge-Control Electronics  appeared first on EE Times.

EE Times · 17 AUG 2026Read more →

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General

Copper’s Grip On AI Scaling Is Starting To Slip

As AI clusters push beyond rack-scale limits, optical interconnects and circuit switching are reshaping how data centers scale. The post Copper’s Grip On AI Scaling Is Starting To Slip appeared first on Semiconductor Engineering.

Semiconductor Engineering · 13 AUG 2026Read more →

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Data Center

What Will It Take To Deploy CPO At Scale?

The path to widespread deployment of co-packaged optics depends on solving challenges in manufacturing, testing, and operations. The post What Will It Take To Deploy CPO At Scale? appeared first on Semiconductor Engineering.

Semiconductor Engineering · 13 AUG 2026Read more →

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General

Linear Optics And The Push To Scale AI Interconnects

Move signal processing back onto the host SerDes to reduce system power, latency, and thermal load. The post Linear Optics And The Push To Scale AI Interconnects appeared first on Semiconductor Engineering.

Semiconductor Engineering · 13 AUG 2026Read more →

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Data Center

Meta Cuts Server Count 25% by Reusing Old Memory: Can Anyone Else Do It?

Meta squeezes 25% fewer servers from old DDR4 via CXL, but most firms face messy DIMM, power, and telemetry traps. The post Meta Cuts Server Count 25% by Reusing Old Memory: Can Anyone Else Do It? appeared first on EE Times.

EE Times · 12 AUG 2026Read more →

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General

Kemplink—new company develops cables and connectors for EV charging

Finnish technology firm Kemppi Group has established a new subsidiary called Kemplink, which designs and manufactures high-power DC fast charging cables for electric passenger vehicles and heavy-duty transport, and develops cables, connectors and supporting systems for the charging infrastructure of the future. Kemplink’s products and technology have been under development within Kemppi Group for the... Read more »

Charged EVs · 12 AUG 2026Read more →

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General

Download Panduit’s guide to building scalable EV charging infrastructure

Sponsored by TTI. As EV charging networks scale, every connection, cable, enclosure and safety system matters. Download Panduit’s EVSE solutions guide to explore a complete portfolio of electrical infrastructure products for designing, installing and maintaining charging equipment. From grounding and power connectors to cable management, identification, safety and network communication solutions. Download Now

Charged EVs · 12 AUG 2026Read more →

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General

Cinch-Fibreco JCON Junior Bulkhead Expanded Beam Adapter now available from Lane Electronics

Specialist connector distributor Lane Electronics has announced availability of the newly released Cinch-Fibreco JCON series. The JCON Junior Bulkhead Expanded Beam Adapter is designed to simplify panel-mounted fibre-optic connectivity by enabling standard patchcords to be used between the adapter and the transceiver. Until now, high-performance expanded beam connector panel adapters have not offered the same straightforward installation … Read More → "Cinch-Fibreco JCON Junior Bulkhead Expanded

EE Journal · 12 AUG 2026Read more →

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General

ITSA reports Q2 orders up 8%

For Q2, ITSA (Interconnect Technology Suppliers Association) reported revenues down 13% but incredibly positive orders which were up 8% with a strong  B-to-B of 1.30:1. Key ITSA markets were: Consumer […] The post ITSA reports Q2 orders up 8% appeared first on Electronics Weekly.

Electronics Weekly · 12 AUG 2026Read more →

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General

Model Tracks Bond Front Velocity in Lubrication-Mediated Bonding of Flexible Substrates (imec)

An imec researcher published a technical paper titled “Bond Front Velocity in Lubrication-Mediated Bonding of Flexible Substrates.” Abstract: “Bonding and assembly processes have started to take the centre-stage in semiconductor manufacturing as they enable three-dimensional (3D) stacking and heterogeneous integration for novel interconnect architectures of integrated circuits. The progression of a bond front hinges on... » read more The post Model Tracks Bond Front Velocity in Lubrication-Media

Semiconductor Engineering · 07 AUG 2026Read more →

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General

Integrated power and signal connectors for humanoid robots

Molex is sampling  MiniMix Hybrid Power and Signal Connectors for manufacturing and packaging applications in humanoid robotics, autonomous mobile robots (AMRs) and  industrial automation. Combining 15.0A power and high-speed Ethernet […] The post Integrated power and signal connectors for humanoid robots appeared first on Electronics Weekly.

Electronics Weekly · 06 AUG 2026Read more →

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Data Center

CXL controller scales server memory

Montage Technology has introduced the M88MX6852, a CXL 3.2 Memory eXpander Controller (MXC) chip for AI data center applications. The post CXL controller scales server memory appeared first on EDN.

EDN · 05 AUG 2026Read more →

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General

Silicon Photonics MEMS-based Optical Switch Using a Zero-Change Foundry–Compatible Process (UC Berkeley)

Researchers from UC Berkeley published a technical paper titled “Zero-change foundry compatible silicon photonics MEMS optical switch.” Abstract Excerpt: The paper demonstrates a broadband silicon photonics MEMS switch with “more than 30 dB extinction ratio” using a “zero-change foundry compatible process and Back-end-of-Line (BEOL) post-processing.” It also reports insertion loss of “less than 1.5 dB”... » read more The post Silicon Photonics MEMS-based Optical Switch Using a Zero-Change Foundr

Semiconductor Engineering · 05 AUG 2026Read more →

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General

AI Data Centers Look Beyond Just GPUs

Focus shifts to clusters of heterogeneous processing elements and faster interconnects. The post AI Data Centers Look Beyond Just GPUs appeared first on Semiconductor Engineering.

Semiconductor Engineering · 05 AUG 2026Read more →

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FPC

Why integrated FPC-based cell contact solutions are essential to battery pack manufacturing

Sponsored by Churod Electronics. Increased battery density is the endgame of all cutting-edge battery design, improvements cannot come at the expense of safety or cost limitations. The question then becomes how to push the envelope in a safe and cost-effective way. Monitoring the state-of-health of cells is at the top of the list of considerations. Accurately... Read more »

Charged EVs · 03 AUG 2026Read more →

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General

UL releases an important new V2G standard

Vehicle-to-grid (V2G) technology is gradually making the transition from pilots to commercial applications. At the moment, a few automakers, including GM, Ford and Nissan, offer bidirectional charging features, but these require proprietary charging hardware, and are limited to applications such as backup power (V2H). True V2G functionality requires a utility interconnection, and for this, up-to-date... Read more »

Charged EVs · 31 JUL 2026Read more →

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General

Optimize hi-rel designs with rugged, flexible interconnects

Rugged and flexible interconnects support miniaturization, easier integration, and reliable performance. The post Optimize hi-rel designs with rugged, flexible interconnects appeared first on EDN.

EDN · 30 JUL 2026Read more →

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Data Center

Previewing FMS 2026: The Next Frontier of Enterprise Memory, CXL, and AI-Era Storage

For anyone tracking enterprise infrastructure, the storage landscape is moving at a breakneck pace. The explosive growth of generative AI, multi-million token context windows, and massive data-centric workloads have pushed traditional memory and storage architectures to their absolute limits. This August, the industry… Read More The post Previewing FMS 2026: The Next Frontier of Enterprise Memory, CXL, and AI-Era Storage appeared first on SemiWiki.

SemiWiki · 29 JUL 2026Read more →

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General

From Co-Packaged Optics to Nanolasers: Photonics Moves Inward

CEA-Leti, Scintil Photonics, and NcodiN show how optical interconnects are moving from data center racks toward co-packaged optics and chiplet-level communication. The post From Co-Packaged Optics to Nanolasers: Photonics Moves Inward appeared first on EE Times.

EE Times · 29 JUL 2026Read more →

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General

Chip Industry Technical Paper Roundup: July 28

HW methods to throttle AI; M3D DRAM; interconnect signal-integrity analysis; 3D mask effects in high/hyper-NA EUV litho; compute-in-interconnect and memory; NbAs nanowire interconnects; and 3D conformal thin-film patterning. The post Chip Industry Technical Paper Roundup: July 28 appeared first on Semiconductor Engineering.

Semiconductor Engineering · 28 JUL 2026Read more →

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General

Advanced thermal management and packaging techniques for SiC

Advanced SiC packaging techniques covering die-attach, interconnects, substrates, encapsulation, and cooling for thermal management. The post Advanced thermal management and packaging techniques for SiC appeared first on Power Electronics News.

Power Electronics News · 27 JUL 2026Read more →

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General

Chip Industry Week In Review

Amkor's $1.5B deal; Intel Foundry revenue up 31%; Siemens' dual buys; SiC plant dies; AMD's big week; TSMC price hike; Nokia's fab buy; earnings; $300M for accelerating inference; Keysight's multiphysics; copper interconnect alternative. The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

Semiconductor Engineering · 24 JUL 2026Read more →

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General

Trio of Connectors Take Aim at Designs for Cars, Computing, and Controls

Molex, TE Connectivity, and Samtec have introduced new connector platforms targeting next-generation automotive networking, industrial electronics, and AI computing.

All About Circuits · 20 JUL 2026Read more →

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General

New Demands on RF Interconnects—How 5G and AI are Redefining RF Designs

5G, AI, and quantum computing are pushing RF interconnects to their limits. Learn how engineers are evolving connector designs to ensure signal integrity in compact, high-speed systems.

All About Circuits · 16 JUL 2026Read more →

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General

Digital Surveillance Reshapes Fishery Enforcement in Indonesia

In the eastern Indian Ocean, south of Java in the vast sea stretching toward Australia, a fishing vessel slightly alters its course while operating near the boundary of its authorized fishing ground. Nothing appears unusual on deck. Nets remain in the water. Engines maintain a steady speed. To the crew, it is an ordinary day at sea. Yet hundreds of kilometers above, satellites continuously record the vessel’s position. At Indonesia’s Marine and Fisheries Resources Surveillance Station, in Cilaca

IEEE Spectrum · 16 JUL 2026Read more →

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General

The Evolution of Cobots and Single Pair Ethernet (SPE)

Cobots are taking on repetitive and heavy-duty tasks in factories and warehouses, while Single Pair Ethernet and standardized connectors are creating the connected backbone for smarter automation.

Machine Design · 13 JUL 2026Read more →

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General

IEEE Remembers Pioneering Computer Scientist Peter G. Neumann

The computing community recently lost one of its enduring voices: IEEE Fellow Peter G. Neumann. The renowned computer scientist and respected risk analyst died on 17 May at the age of 93. For almost 70 years, Neumann shaped the computing field through his pioneering work on risks, system dependability, security, and fault tolerance with rare intellectual depth and unwavering ethical clarity. Five of those decades were spent as a principal scientist at SRI International in Menlo Park, Calif., whe

IEEE Spectrum · 10 JUL 2026Read more →

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General

Connectors are a Major EMI Weakness

Mitigating EMI is critical for good system design and connectors are a good place to start.

Electronic Design – Power · 10 JUL 2026Read more →

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General

Waterproof USB-C Connectors Expand Application Arena

It seems these days that USB-C is everywhere in consumer products, and waterproof versions can extend its applicability.

Electronic Design – Components · 05 MAY 2026Read more →

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Advanced Connectivity in Extreme Environments

When deploying connectors engineered to perform in extreme temperatures and harsh environments, it’s important to understand customer needs to deliver tailored solutions.

Electronic Design – Components · 24 MAR 2026Read more →

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What Matters When Choosing High-Reliability Connectors

From harsh environments to supplier stability, choosing connectors for high-reliability designs comes down to more than performance.

Electronic Design – Components · 19 FEB 2026Read more →

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General

Modular Automotive Connectors Support Zonal Architectures – and More

A new line of automotive connectors from Molex handles multiple cable and signal types in a modular shell.

Electronic Design – Components · 12 JAN 2026Read more →

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Board-to-Board

TE Connectivity – Connectors adopted as the standard design into the SNIA

TE Connectivity has released its new Sliver card edge connectors … More >

Electropages – All News · 30 APR 2019Read more →

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Foremost Electronics – Expanded range of harsh environment connectors available now

Foremost Electronics now offers the availability of the latest additions … More >

Electropages – Switches, Relays & Onboard · 29 APR 2019Read more →

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Board-to-Board

AVX – New wire-to-board RF coaxial IDC connectors for industrial and automotive applications

AVX Corporation has delivered what is claimed to be the … More >

Electropages – Switches, Relays & Onboard · 29 APR 2019Read more →

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General

Stewart Connector – PCB mount series expanded with right-angle USB 2.0 connectors

Stewart Connector, a Bel group company, has extended the SealJack … More >

Electropages – Switches, Relays & Onboard · 26 APR 2019Read more →

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Mouser – Connector line card expanded with a new global distribution agreement

Mouser has signed a global distribution agreement with ODU. The … More >

Electropages – Switches, Relays & Onboard · 23 APR 2019Read more →

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Board-to-Board

TTI Europe – Durable and robust board-to-board connectors offer increased reliability

Archer Kontrol is a range of compact board-to-board 1.27mm pitch … More >

Electropages – Switches, Relays & Onboard · 16 APR 2019Read more →

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General

Lane Electronics – Distributor first to be approved to assemble high-density connector systems

Lane Electronics and its specialist Motorsport Division, Lane Motorsport, have … More >

Electropages – Switches, Relays & Onboard · 15 APR 2019Read more →

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