The Open Compute Project (OCP) publishes open hardware specifications for hyperscale data centers. When a data sheet says "OCP-compliant," it rarely means one connector. OCP covers many separate specifications, from the rack and its power to the storage drives, network cards, management modules and cooling couplings, and each one points to its own connector family.
This guide is a map. It shows which OCP domain uses which connector, and links to our detailed article for each.
In short:
- There is no single "OCP connector." Each OCP specification references its own connector family, and some of those connectors are defined by other standards bodies.
- Always ask a supplier which OCP specification and which revision a part was designed or validated against.
- Our articles below cover each domain in detail.
Map of OCP Domains and Connectors
- Rack power (Open Rack v3): ORv3 moves power distribution to a 48 V vertical busbar with blind-mate power connections between the shelf, the busbar and each blade. See ORv3 busbar power connectors, and for where rack power is heading, our guide to the 800 VDC power delivery shift.
- Power supplies (CRPS): the Common Redundant Power Supply defines a standard supply form factor with a card-edge power connector. See our CRPS connector guide.
- Server host boards (DC-MHS): the Datacenter Modular Hardware System standardizes modular server building blocks. Its M-XIO interface uses cabled PCIe connections such as MCIO. See M-XIO and MCIO connectors.
- Management modules (DC-SCM): the Datacenter Secure Control Module separates management and security functions onto their own card. LTPI, which stands for LVDS Tunneling Protocol and Interface, is the protocol that carries low-speed signals between the host module and the SCM, and it is a protocol, not a connector. See the DC-SCM connector guide.
- Storage (EDSFF): E1.S and E3.S drives use SFF-TA-1002 connectors. EDSFF itself is defined by the SNIA SFF group, and OCP server designs reference it. See EDSFF connectors explained.
- Accelerator modules (OAM): the OCP Accelerator Module defines a modular accelerator card and its high-density mezzanine connectors. See OAM connectors.
- Network cards (OCP NIC 3.0): NIC 3.0 cards plug into the host with card-edge connectors from the SFF-TA-1002 family. See OCP NIC 3.0 interconnects.
- Liquid cooling (UQD): OCP's Universal Quick Disconnect specification defines hand-mate and blind-mate liquid couplings. See UQD and UQDB quick disconnects, and for rack examples, Meta IcePack and NVIDIA MGX 1.2.
What "OCP-Compliant" Does and Doesn't Mean
- Open specifications are public documents. A supplier can design a connector to one, but the specification itself usually does not name a single part number.
- OCP also runs product recognition programs, including OCP Accepted and OCP Inspired. These are not the same as a connector passing a test, so ask which one, if any, applies.
- Specifications have revisions. A part validated against an older revision may not match the current one.
- Connectors in OCP designs often come from other standards, such as SFF-TA-1002, so the connector's own specification matters as much as the OCP document.
Questions to Ask a Connector Supplier
- Which OCP specification, and which revision, was this part designed or validated against?
- Is the compliance claim backed by test data, or is it a statement of intent?
- What are the current rating, mating cycle life and mating force at the intended operating temperature?
- For blind-mate parts, how much misalignment can the connector absorb?
- Is the part a drop-in match for the connector named in the specification, or only similar?
For a checklist focused on rack connectors, see our guide to ORv3 connector compliance requirements, and for more coverage, visit our OCP server interconnects hub.
OCP specifications are revised over time. Check the current version on the Open Compute Project site before finalizing a design.